A light emitting diode aggregate module and a method for manufacturing a light emitting diode aggregate module.

摘要

A light emitting diode aggregate module comprises a metallic base printed circuit board (1), light emitting diode chips (2) each of which is mounted on a bottom section of each hollow section (23) formed on the metallic base printed circuit board (1), electronic parts (3) which are mounted on the metallic base printed circuit board (1) and outside of the hollow sections (23), bonding wires (5b) each of which interconnects the light emitting diode (2) and each land section (5) which is formed in the hollow section (23), soft resin layers (6) each of which covers corresponding light emitting diode chip (2) and corresponding bonding wire (5b), and a lens board (20) which is formed in one body on the matallic base printed circuit board (1) by insert molding of translucent resin and has lens sections (20a) each of which corresponds to each light emitting diode chip (2).