发明名称 Method of manufacturing a pressure sensor assembly
摘要 A carrier frame has cells with inwardly extending thin flexible tabs. Pressure sensor housings are molded into the frame cells such that only the tips of the tabs penetrate the housing wall and after processing the housings are readily pushed out of the frame. A lead frame is insert molded at the same time. During molding the cells of the frame are open ended and after molding a reinforcing tie bar is attached across the open side of the frame to close the cells. A flange is bent up on the opposite side to lend rigidity to the frame. Preformed code flags are provided in the frame and selectively bent out for coding.
申请公布号 US5377403(A) 申请公布日期 1995.01.03
申请号 US19930103146 申请日期 1993.08.09
申请人 DELCO ELECTRONICS CORP. 发明人 HART, JR., JOHN M.;MATLY, JOHN M.
分类号 G01L9/00;H01L21/673;H05K13/00;(IPC1-7):H01R43/00 主分类号 G01L9/00
代理机构 代理人
主权项
地址