| 摘要 |
An automatic mass handling system for the bonding of electronic components in small electronic devices, includes a plurality of modules for holding a plurality of the electronic devices in a predetermined orientation, each module including a cup-shaped main body having a circumferential wall and a bottom wall which closes a bottom of the circumferential wall, a top component holding wall secured to an upper surface of the circumferential wall and having a plurality of component holding holes therein for retaining the plurality of electronic devices therein, an aligning member for aligning the electronic devices in the component holding holes in a predetermined orientation, and a vacuum hold down hole formed in the bottom wall, for holding the electronic devices in the predetermined orientation in the plurality of component holding holes when a vacuum is applied through the vacuum hold down hole; and a boat for holding a plurality of the modules in a predetermined orientation for transportation.
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