| 摘要 |
A quad leadframe (22') for a CERQUAD is manufactured using conventional cladding and stamping technologies. A first metal layer (12) is provided with multiple cavities (14). A second metal layer (14) is clad to the first metal layer. A leadframe strip (22) can then be stamped from the clad metal. The leadframe has a leads (24) and bonding posts (28). The leads comprise two metal layers, and the bonding posts comprise only the second metal layer. The leadframe can then be used in the assembly of a semiconductor device (32). The portion of the leads external to the package body can be optionally etched to remove the second metal layer.
|
