发明名称 Method of applying a thin coating on the lower surface of a bilevel substrate
摘要 A method of applying a thin coating to the lower surface of a bilevel substrate includes the following steps: A liquid coating, such as a material useful as an alignment layer, is applied over a bilevel substrate, such as an LCD panel. The bilevel substrate may have flat-topped ribs or other protrusions so long as the tops of the protrusions are coplanar. Next, a leveling device, such as a doctor blade, is moved across the upper surface of the bilevel substrate so that the liquid coating is removed from the upper surface but remains on the lower surface. Finally, the liquid coating is hardened and shrunk, e.g., by drying or curing, resulting in a highly uniform hardened coating, such as an alignment layer, on the lower surface of the bilevel substrate.
申请公布号 US5378494(A) 申请公布日期 1995.01.03
申请号 US19940198895 申请日期 1994.02.18
申请人 MINNESOTA MINING AND MANUFACTURING COMPANY 发明人 THOMAS, PATRICK A.;WENZ, ROBERT P.
分类号 B05D1/42;G02F1/1337;(IPC1-7):B05D5/12 主分类号 B05D1/42
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