Method for removing organic film

摘要

PCT No. PCT/JP91/01374 Sec. 371 Date Jun. 8, 1992 Sec. 102(e) Date Jun. 8, 1992 PCT Filed Oct. 9, 1991 PCT Pub. No. WO92/06489 PCT Pub. Date Apr. 16, 1992.The method for removing organic film according to the present invention is very effective for removing a photo resist film in a process for manufacturing semiconductor device. A substrate (32) having a photo resist film (31) formed on it is processed in a wet processing tank (34) filled with a processing solution such as a mixed solution containing sulfuric acid and hydrogen peroxide or by a dry processing using oxygen plasma. Then, it is processed in an ozone processing tank (34) filled with a solution where ozone or ozone water has been infused, and the organic film is removed.