| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive-type photosensitizing agent as a component of a radiation-sensitive resin composition capable of forming a resist film having excellent sensitivity, heat-resistance, chemical resistance and transparency in visible light range and useful as a resist material for producing an integrated semiconductor circuit or TFT circuit for LCD, or a permanent film-forming material such as interlayer insulation film and protection film and provide a composition compounded with the agent. <P>SOLUTION: The new fluorene compound is produced by esterifying a naphthoquinone diazide sulfonic acid. The photosensitizing agent contains the fluorene compound, and the radiation-sensitive resin composition contains the photosensitizing agent. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
