| 发明名称 |
An adhesive composition for use in the mounting of electronic parts and a method for mounting electronic parts on a printed circuit board by the use of the same. |
| 摘要 |
<p>An adhesive composition for use in the mounting of electronic parts on a printed circuit board is disclosed. The composition comprises a photosetting and thermosetting resin ingredient and a long-chain saturated fatty acid amide. Also disclosed is a method for mounting electronic parts on a printed circuit board by the use of such an adhesive composition.</p> |
| 申请公布号 |
EP0378233(B1) |
申请公布日期 |
1994.12.28 |
| 申请号 |
EP19900100635 |
申请日期 |
1990.01.12 |
| 申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
AKIGUCHI, TAKASHI;MAEDA, YUKIO |
| 分类号 |
C08K5/20;C08L63/00;C09J201/00;H05K3/30;(IPC1-7):H05K3/30;C09J5/00 |
主分类号 |
C08K5/20 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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