| 发明名称 |
External circuit connecting method and packaging structure. |
| 摘要 |
<p>There is disclosed a method of connecting an external circuit, comprising disposing between an electrode (15) for connecting the external circuit (18) connected with an electrode for driving a liquid crystal panel (14) and an external circuit electrode (13) connected with the external circuit (18), a film (11) comprising an insulating resin containing conductive particles dispersed therein, and applying a pulse voltage (17) to a heat tool (16) under the pressure-applied state.</p> |
| 申请公布号 |
EP0289026(B1) |
申请公布日期 |
1994.12.28 |
| 申请号 |
EP19880106849 |
申请日期 |
1988.04.28 |
| 申请人 |
CANON KABUSHIKI KAISHA |
发明人 |
YABU, SHIGEKI;TAKABAYASHI, HIROSHI |
| 分类号 |
G02F1/13;H05K3/32;H05K3/34;H05K3/36;(IPC1-7):G02F1/133;H01R4/04;G09G3/18;H05K3/40 |
主分类号 |
G02F1/13 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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