| 摘要 |
A PTC semiconductor heating device includes: two half shells combinable for forming a housing of the semiconductor heating device, a plurality of linear arrays of PTC semiconductor heating elements parallelly mounted in the housing with each linear array containing a plurality of PTC semiconductor heating elements longitudinally disposed in a side-by-side linear arrangement in said housing and each linear array of PTC heating elements being sandwiched in between every two neighboring thermally and electrically conducting units respectively connected to two poles of a power source and longitudinally juxtapositionally mounted in the housing each thermally and electrically conducting unit including a corrugated fin plate formed with a plurality of continuous square waves and clamped by a pair of conducting plates, and a plurality of resilient embedding plates each embedding plate resiliently inserted in between every two neighboring thermally and electrically conducting units for firmly tensioning, packing and retaining all the PTC heating elements, the conducting units and the embedding plate in the housing to eliminate any welding or bonding joint processing for their assembly for saving production cost and enhancing heating efficiency thereof.
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