发明名称 Structure for a semiconductor device comprising conductive trench sidewalls
摘要 A structure for a semiconductor integrated circuit device comprises a p-type transistor and an n-type transistor, with each transistor having two diffusion regions. A trench interposed between the two transistors comprises a pair of conductively doped sidewalls. One sidewall is electrically coupled with power, and the other is electrically coupled with ground. A diffusion region from each transistor is electrically coupled with one of the sidewalls, with one transistor receiving power and the other receiving ground from the conductive sidewalls. The two transistor diffusion regions not electrically coupled with one of the sidewalls are electrically interconnected.
申请公布号 US5376817(A) 申请公布日期 1994.12.27
申请号 US19940194772 申请日期 1994.02.09
申请人 MICRON TECHNOLOGY, INC. 发明人 SEYYEDY, MIRMAJID;DURCAN, D. MARK
分类号 H01L27/02;(IPC1-7):H01L27/02;H01L23/48;H01L23/40 主分类号 H01L27/02
代理机构 代理人
主权项
地址