Precursor composition capable of yielding a polyimidesilicone resin

摘要

A polyimidesilicone resin precursor composition which comprises a polysiloxane of the following general formula <IMAGE> wherein R is a monovalent organic group having up to 10 carbon atoms, R1 represents a hydrogen atom or a monovalent organic group having up to 10 carbon atoms, and m is an integer not smaller than 3, and a polyamic acid or a polyimide obtained from the polyamic acid. The composition is cured at a relatively low temperature within a short time to provide a cured film having improved solvent and heat resistances and good adhesion to various substrates.