发明名称 |
Methods for making multilayer printed circuit boards |
摘要 |
A method for making a multilayered printed circuit board including the steps of arranging two plates in spaced relation, arranging a perimetral seal between the two plates with an upper opening in the seal to form an upwardly open chamber, placing a plurality of printed circuit boards between the plates in spaced relation to one another, placing the chamber under vacuum, injecting a settable matrix material into the chamber, compressing the end plates towards one another to achieve the desired outer dimensions of the board, and curing the settable matrix material.
|
申请公布号 |
US5376326(A) |
申请公布日期 |
1994.12.27 |
申请号 |
US19890398344 |
申请日期 |
1989.08.23 |
申请人 |
COMPOSITECH LTD. |
发明人 |
MEDNEY, JONAS;KLIMPL, FRED E. |
分类号 |
B32B15/08;B29B15/10;B29B15/12;B29C53/56;B29C53/58;B29C53/76;B29C53/80;B29C70/06;B29C70/10;B29C70/16;B29C70/20;B29C70/34;B29K105/08;B29L9/00;B29L31/34;B32B5/12;B32B5/28;C08J5/24;H05K1/02;H05K1/03;H05K3/00;H05K3/36;H05K3/46;(IPC1-7):B29C45/16;B29C45/14;B32B17/04 |
主分类号 |
B32B15/08 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|