发明名称 Methods for making multilayer printed circuit boards
摘要 A method for making a multilayered printed circuit board including the steps of arranging two plates in spaced relation, arranging a perimetral seal between the two plates with an upper opening in the seal to form an upwardly open chamber, placing a plurality of printed circuit boards between the plates in spaced relation to one another, placing the chamber under vacuum, injecting a settable matrix material into the chamber, compressing the end plates towards one another to achieve the desired outer dimensions of the board, and curing the settable matrix material.
申请公布号 US5376326(A) 申请公布日期 1994.12.27
申请号 US19890398344 申请日期 1989.08.23
申请人 COMPOSITECH LTD. 发明人 MEDNEY, JONAS;KLIMPL, FRED E.
分类号 B32B15/08;B29B15/10;B29B15/12;B29C53/56;B29C53/58;B29C53/76;B29C53/80;B29C70/06;B29C70/10;B29C70/16;B29C70/20;B29C70/34;B29K105/08;B29L9/00;B29L31/34;B32B5/12;B32B5/28;C08J5/24;H05K1/02;H05K1/03;H05K3/00;H05K3/36;H05K3/46;(IPC1-7):B29C45/16;B29C45/14;B32B17/04 主分类号 B32B15/08
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