发明名称 Semi-internally manifolded interconnect
摘要 A semi-internally manifolded interconnect structured for placement between successive electrolyte elements in stack of elements having a first surface with a level margin extending substantially around the perimeter of the interconnect, first and second manifold channels disposed inward from the margin, and a plurality of gas-flow channels disposed in a central area of the first surface and extending between and in fluid communication with the first and second manifold channels.
申请公布号 US5376472(A) 申请公布日期 1994.12.27
申请号 US19930133443 申请日期 1993.10.06
申请人 CERAMATEC, INC. 发明人 HARTVIGSEN, JOSEPH J.;KHANDKAR, ASHOK C.;ELANGOVAN, SINGARAVELU;PROUSE, DAVID W.
分类号 H01M8/02;H01M8/10;H01M8/12;(IPC1-7):H01M8/10;H01M2/14 主分类号 H01M8/02
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