Coating solution for forming transparent conductive coating and process for preparing same

摘要

PCT No. PCT/JP91/01603 Sec. 371 Date Jul. 20, 1992 Sec. 102(e) Date Jul. 20, 1992 PCT Filed Nov. 21, 1991 PCT Pub. No. WO92/09665 PCT Pub. Date Jun. 11, 1992.Conductive substrate having on their surface a coating formed from a coating solution for forming a transparent conductive coating prepared by dispersion of dissolving in water and/or organic solvent such conductive particles as having (a) an average particle diameter of not more than 500 ANGSTROM , wherein (b) an amount of particles having a particle diameter of not more than 600 ANGSTROM is more than 60% by weight, (c) an amount of particles having a particle diameter of not more than 100 ANGSTROM is more than 5% by weight and (d) an amount of particles having a particle diameter of more than 1000 ANGSTROM is not more than 15% by weight, and a matrix comprising a silica polymer having (A) an average degree of polymerization of 1,500-10,000, and (B) an amount of the polymer having a degree of polymerization of not more than 3,000 being not more than 50% by weight, and (C) an amount of the polymer having a degree of polymerization of more than 10,000 being not more than 20% by weight, are excellent in adhesion and surface smoothness and also excellent in durability and transparency. Display devices provided with the above-mentioned transparent conductive substrates as the display panel are excellent in resolving power, and give constantly clear and sharp images.