发明名称 Surface mountable electronic part
摘要 The size precision of a surface mountable electronic part is improved and a production thereof is simplified. The surface mountable electronic part is constructed such that a circuit substrate is housed in a shield case of which an end side is open, and the shield case is a resin case having a shield film. A connection pattern is formed on the inner surface of the case, with one end of the connection pattern being disposed so as to correspond to an external connection land of the circuit substrate, and with the other end of the connection pattern extending to the open end of the case.
申请公布号 US5377081(A) 申请公布日期 1994.12.27
申请号 US19920956063 申请日期 1992.10.02
申请人 MURATA MANUFACTURING CO., LTD. 发明人 BIZEN, TATSUO;INOUE, ATSUSHI;FUNADA, YOU;UNO, MASAO;HATA, TOSHIO;KONGO, KOUICHI
分类号 H01L23/00;H01L25/16;H05K1/00;H05K1/14;H05K3/34;H05K3/36;H05K5/00;H05K9/00;(IPC1-7):H05K9/00 主分类号 H01L23/00
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