发明名称 LIQUID COATING APPARATUS FOR ELECTRONIC COMPONENT
摘要 PURPOSE:To convey an electronic component and coat it with liquid for a common use, and to reduce in size and automate in apparatus by providing a groove on a rail for conveying the component, circulating liquid to be coated in the groove, inserting outer leads to the groove, and moving the component. CONSTITUTION:A conveying rail 1 has a groove 4, and a plurality of passages 1a for feeding flux are formed along the groove 4 on a periphery of the groove 4. Since the groove 4 is formed with a slight allowance for a thickness of a lead 3a, a surface tension is generated, and predetermined flux liquid is held in the groove 4. A semiconductor device 3 is placed in the groove 4 of the rail 1, and conveyed by a conveying arm 8. In this case, the flux liquid in the groove 4 is circulated by a pump 10 while controlling a circulating amount to coat a suitable amount on the lead 3a of the device. Thus, the device is reduced in size and its automation is largely improved, occurrence of excess flux is eliminated, and a problem due to chemical change is obviated.
申请公布号 JPH06349991(A) 申请公布日期 1994.12.22
申请号 JP19930140342 申请日期 1993.06.11
申请人 HITACHI LTD;HITACHI TOBU SEMICONDUCTOR LTD 发明人 OTANI JUNICHI
分类号 B23K3/00;H01L23/48;H01R43/02;(IPC1-7):H01L23/48 主分类号 B23K3/00
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