| 摘要 |
PURPOSE:To reduce a metal cap in space by providing a frame for installing it to surround a semiconductor chip and filling resin therein, and the cap so arranged as to cover the frame. CONSTITUTION:A semiconductor chip 2 and an electronic component 3 are mounted on a board 1. A frame 6 is disposed around the chip 2, and resin 4 is so filled as to be embedded in the frame 6. Then, a metal cap 7 of a shape in which a sidewall of a part to be superposed on the frame 6 is cut is so disposed as to be brought into contact with an upper surface of the frame 6. Part of a ceiling of the cap is adhered to an upper part of the resin 4, and fixed to the board by a pin provided at a lower end of the cap 7. Thus, the cap 7 can be reduced in size. |
