发明名称 MICROELECTRONIC CIRCUIT STRUCTURE AND ITS MANUFACTURE
摘要 PURPOSE: To make a leakage current density smaller than that of an HDC material having identical thickness and electrode by making the leakage current density of a material having first and third leakage current densities substantially smaller than that of the material having a second leakage current density. CONSTITUTION: A first thin dielectric buffer layer is formed of a material 32, which has a first medium level dielectric constant and a second leakage current density, and a layer having a high dielectric constant is formed of a material 34, which has a first leakage current density, over the first thin dielectric butter layer. Furthermore, a second thin dielectric buffer layer is formed of a material 36, having a second medium level dielectric constant and a third leakage current density over the layer of a high dielectric constant. Then, the leakage current density of the material, having the first and the third leakage current densities, is made substantially smaller than that of the material having the second leakage current density. Thus, deterioration of dielectric constant becomes moderate and the leakage current can be structurally reduced and compensated.
申请公布号 JPH06350029(A) 申请公布日期 1994.12.22
申请号 JP19940060932 申请日期 1994.03.30
申请人 TEXAS INSTR INC <TI> 发明人 SUKOTSUTO AARU SAMAAFUERUTO;HAWAADO AARU BERATAN
分类号 H01G4/33;H01G4/30;H01G7/06;H01L21/02;H01L21/822;H01L27/04;H01L27/115 主分类号 H01G4/33
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