| 摘要 |
PURPOSE:To impart the light reflective function through the light reflection characteristics of a secondary molded item while protecting the circuit pattern by forming the circuit pattern on the surface of a primary molded item including the interface between the primary and secondary molded items. CONSTITUTION:A primary molded item 1 is molded of a primary resin having solderability and solder heat resistance. A resist pattern of the primary molded item 1 is then formed and a circuit pattern 3 of conductive material is formed on the upper and lower faces of the primary molded item 1 and on the inner face of a through hole 8. Subsequently, a secondary molded item 5 is integrally molded of a secondary resin having light reflectivity on the upper face of the primary molded item except the exposed parts 4, i.e., a pair of terminal parts 3d, 3d, thus covering and protecting the main part of a circuit part 3a. Finally, the board is cut along each groove 9 and at the intermediate position of the through holes 8, 8 in the direction perpendicular to the groove 9 thus forming a solid circuit board S. |
