发明名称 PLATE-SHAPED CIRCUIT PACKAGE
摘要 PURPOSE:To enable high-density and multi-core connection. CONSTITUTION:An insulating board 13 is provided on one side of a substrate 2, and this insulating board 13 has a hole 14 piercing itself in thickness direction and a conductor 15 covering the inside of this hole 14, and this connection 3 and the said conductor 15 are connected conductively. Moreover, it has a connector terminal 19, where a tubular hole 18 is made, and this connector terminal 19 is connected to the connection 3.
申请公布号 JPH06349553(A) 申请公布日期 1994.12.22
申请号 JP19930134214 申请日期 1993.06.04
申请人 JAPAN AVIATION ELECTRON IND LTD 发明人 ICHIMURA YOSHIAKI;YAMAGISHI YUICHI
分类号 H01R24/00 主分类号 H01R24/00
代理机构 代理人
主权项
地址