| 摘要 |
PURPOSE:To miniaturize a flip chip connection semiconductor package, improve heat dissipating efficiency and electric characteristics, and realize cost reduction. CONSTITUTION:An IC chip 3 is bonded to the upper surface side of a printed wiring board 1 via flip chips 4, and resin sealed with sealing resin 5 by side potting. On the lower surface side of the printed circuit board 1, solder balls 6 whose melting point is lower than that of the flip chips 4 are arranged and heated. Hence solder bumps 7 for mother board connection are formed without fusing the flip chips 4. Thereby reliability of electric connection and heat dissipating efficiency are improved, and the cost reduction of a small-sized semiconductor package is enabled.
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