| 摘要 |
<p>PURPOSE:To improve operability when a heat sink is adhered to a package and to eliminate malfunctions due to overflow of adhesive resin, occurrence of a gap, etc. CONSTITUTION:A semiconductor device has a structure in which a semiconductor element 4 is placed on one side surface, and a heat sink 1 is placed on its opposite surface with resin adhesive 2, and uses as the resin adhesive 2 adhesive formed by mixing heat conductive filler with thermoplastic resin having a glass transition temperature of 200 deg.C or lower. The adhesive is previously formed in a sheet state, temporarily adhered to an adhering surface of the sink 1 or adhesive (liquidlike adhesive) is previously adhered to the adhering surface of the sink 1 by screen printing, etc., then applied to a package 3, heated and pressurized to be adhered.</p> |
