| 摘要 |
PURPOSE:To mount a semiconductor device effeciently on a smaller mouning area for the semiconductor device to be superposed and mounted onto a printed wiring board. CONSTITUTION:Two semiconductor devices 11, 21 are superposed up and down, and the electrodes 13, 23 of the opposed surfaces of the semiconductor device are connected electrically. The outer leads 14, 24 of each semiconductor device 11, 21 are connected to foot prints 32, 33 on a printed wiring board 31 under a state, in which both electrodes 13, 23 are connected. Accordngly, the two semiconductor devices 11, 21 superposed and mounted while signal conductors capable of being used in common are replaced with the electrodes 13, 23 thus decreasing the number of the outer leads 14, 24, then miniaturizing a device.
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