Verfahren zum Herstellen einer Halbleiteranordnung vom harzumhüllten Typ.

摘要

An electrically-insulated type semiconductor device to be resin-moulded has a rear surface (BS) which can be set in direct contact with a heat radiation section (200) and a front surface (FS) opposite to the rear surface (BS). This semiconductor device includes a metal lead frame (2-3) having a tip end portion (2*) sandwiched between the resin rear surface (BS) and resin front surface (FS) and a mounting portion (2) on which a semiconductor chip (1) is mounted, and frame supporting holes (8) formed to penetrate from the resin front surface (FS) to the mounting portion (2) of the lead frame (2-3). The frame supporting holes (8) are formed by supporting pins (FP) for positioning the mounting portion (2) of the lead frame (2-3). The frame supporting holes (8) are formed only in the resin front surface (FS), and the lead frame (2-3) is formed in such a shape that a thickness (T2) of resin mould (6*) existing between the resin rear surface (BS) and the tip end portion (2*) of the lead frame (2-3) is set to be larger than a thickness (T1) of resin mould (6*) existing between the resin rear surface (BS) and the mounting portion (2) of the lead frame (2-3).