| 摘要 |
<p>PURPOSE:To protect from external force a semiconductor laser chip that projects laser light, a photodiode chip for monitoring that receives the light and wires that electrically connect these conductors, by providing a protecting member to cover the semiconductor laser chip, photodiode chip and wires. CONSTITUTION:A lead 26 is mounted on one side of the chip mounting section 25 of a common lead 24, and electrically connected with a semiconductor laser chip 21 through a wire 29. Another lead 27 is mount on the other side of the chip mounting section 25, and electrically connected with a photodiode chip 22 for monitoring through a wire 30. The semiconductor laser chip 21, photodiode chip 22 for monitoring and wires 29 and 30 are covered with resin, and all of them are covered with a plastic protecting member 31. The cylindrical protecting member 31 is closed at one end and can be horizontally divided into an upper half 32 and a lower half 33.</p> |
