发明名称 METAL MOLD FOR MOLDING ELECTRONIC PARTS
摘要 PURPOSE:To obtain a metal mold of a unique construction promoting the kind changing work of electronic parts by providing a lower mold die set part with a transfer mechanism part and making the lower mold chase part freely attached and detatched respectively. CONSTITUTION:A lower mold die set part 23 is provided side by side with a transfer mechanism part and a lower mold chase part 27 freely attached and detatched. Further, an upper mold chase part 28 is freely attached and detached to an upper mold die set part 24 connected to a press device. For instance, the transfer mechanism part is to be composed of a pot block 35 having a plurality of pots, a plunger 11 for press and transfer of hard-curing molding resin melted inside the pots and a transfer driving mechanism for plunger operation. Thereby, at the time of manufacturing different products, it suffices to change the lower mold chase part 27 when the number of product cavities and/or a product pitch of the object lead frame are coincided with those ones before the change.
申请公布号 JPH06349872(A) 申请公布日期 1994.12.22
申请号 JP19930164194 申请日期 1993.06.08
申请人 M TEX MATSUMURA KK 发明人 MORIYA TOSHIHARU
分类号 B29C45/02;B29C45/26;B29L31/34;H01L21/56;(IPC1-7):H01L21/56 主分类号 B29C45/02
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