| 摘要 |
A diode 18, 19 and its overvoltage protection resistance 41 are assembled in a moulded resin package. The short lead between the diode and the resistance eliminates stray capacitance from the circuit and makes the device suitable especially for high-frequency use. Instead of being integrated on a substrate 18, the resistance may be mounted within the package on a connecting pin or formed in a connection wire within the package. <IMAGE> |
