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发明名称
LAND SHAPE FOR SOLDER PRECOATING
摘要
申请公布号
JPH06350237(A)
申请公布日期
1994.12.22
申请号
JP19930138660
申请日期
1993.06.10
申请人
SEIKO EPSON CORP
发明人
HIRABAYASHI MITSUO
分类号
H05K3/34;H05K1/11;(IPC1-7):H05K3/34
主分类号
H05K3/34
代理机构
代理人
主权项
地址
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