| 摘要 |
PURPOSE:To provide a method for producing a highly reliable printed wiring board with high yield through a simple process while allowing high density wiring and mounting. CONSTITUTION:The method for producing a printed wiring board comprises a step for arranging a columnar conductive paste at a predetermined position on the main surface of a first base body, a step for positioning the second main surface of the base body at the leading end face of a protruding conductive paste, and a step for separating the opposing faces of the first and second base bodies to elongate the protruding conductive paste substantially in the center and cutting the paste to form a pointed conductive bump. The production method further comprises a step for laminating the conductive bump on a forming face while bringing the main surface of a synthetic resin sheet into contact therewith, and a step for heating the laminate to plastisize the resin component of the synthetic resin sheet and then pressing the laminate to be pierced with the conductive bump in the direction of thickness thus forming a through type conductor wiring part. |
