| 摘要 |
PURPOSE:To allow connection with a surface layer through a non-through hole even in the case of a strip line structure by coating a through hole with a conductor film up to an arbitrary conductor layer thereby connecting the surface layer electrically up to the arbitrary conductor layer. CONSTITUTION:A non-through hole is made and outer layer plating is applied on the entire surface thereof thus forming an outer layer through hole 7. A non-through hole slightly larger than the through hole 7 is then made from the rear side thereof up to a position shallower than the inner layer connecting the non-through hole thus forming a non-through hole 3. All through holes are then filled with a dielectric resin and the surface is polished before outer layer plating is applied thereon. Subsequently, a pad 8b for surface mounting is formed on the non-through hole 3 and the through hole along with an outer layer circuit 8a. Finally, a solder resist 9 is applied thus obtaining a desired printed wiring board. |
