| 摘要 |
The present invention provides a structure and fabricating method of forming conductive traces on a printed circuit board. The method comprises the steps of (a) providing an insulating substrate; (b) forming grooves on the insulating substrate; and (c) filling a first colloid which has a bridging effect with the insulating substrate into the grooves; and (d) filling a second colloid which reacts with the first colloid into the conductive traces.
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