发明名称 WIRE BONDER
摘要 PURPOSE:To simply uniformly press inner leads of a lead frame, and maintain wire bonding of high quality, in a wire bonder. CONSTITUTION:A lead frame support 8 under a lead frame 2 and a lead frame presser foot 1 press a lead frame 2. Plate springs 9 are fixed to contact parts of the presser foot 1 with the lead frame 2 by using fastening screws 10. When the lead frame support 8 and the lead frame presser foot 1 are a little out of parallelism, this deviation is absorbed by the plate springs 9, and inner leads 4 can be uniformly pressed. Another lead frame contact part is formed on the lead frame presser foot 1 via the plate springs, and the frame contact parts and the plate springs are fixed by using fastening screws. By making the fixing size of the fastening screws common, the kinds of lead frames can be changed only by exchanging the lead frame contact parts.
申请公布号 JPH06349881(A) 申请公布日期 1994.12.22
申请号 JP19930133627 申请日期 1993.06.03
申请人 SEIKO EPSON CORP 发明人 OKUHARA YUKIHIRO
分类号 H01L21/60 主分类号 H01L21/60
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