| 摘要 |
PURPOSE:To stably earth an electrode of a semiconductor chip when using the back of the semiconductor chip in a floating state by loading a TAB ring for the ground provided with a plurality of inner leads on a stage by using an insulating adhesive. CONSTITUTION:A semiconductor chip 2 is placed on the central part of a stage 1 of a lead frame electrically insulated from the stage 1. Further, a TAB ring 17 provided with a plurality of inner leads 20 are placed on the stage 1 having the semiconductor chip 2 as the center by using an insulating adhesive. Then, along with circuit connection with a bump for a ground provided around the semiconductor chip 2 and the inner leads 20 of a TAB ring 17, a bump for a signal of the chip 2 and a bump for power supply and a signal terminal of the lead frame and a power supply terminal are wire-bonded. Later, resin molding is performed to the lead frame loaded with the semiconductor chip 2. |
