CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE FOR CIRCUIT MEMBER USING THE SAME AND PRODUCTION METHOD THEREOF
摘要
Disclosed is a circuit connecting material for connecting a first circuit member wherein a plurality of first circuit electrodes are formed on a major surface of a first circuit board with a second circuit member wherein a plurality of second circuit electrodes are formed on a major surface of a second circuit board so that the first circuit electrodes are electrically connected with the second circuit electrodes in such a manner that the first and second circuit electrodes face each other. The circuit connecting material contains an adhesive composition, a conductive particle, and a plurality of insulating particles containing one or both of a polyamic acid particle and a polyimide particle.
申请公布号
WO2008023565(A1)
申请公布日期
2008.02.28
申请号
WO2007JP65376
申请日期
2007.08.06
申请人
HITACHI CHEMICAL COMPANY, LTD.;TATSUZAWA, TAKASHI;KOBAYASHI, KOUJI;FUKUSHIMA, NAOKI;KOBAYASHI, TAKANOBU;ITO, AKIHIRO