发明名称 CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE FOR CIRCUIT MEMBER USING THE SAME AND PRODUCTION METHOD THEREOF
摘要 Disclosed is a circuit connecting material for connecting a first circuit member wherein a plurality of first circuit electrodes are formed on a major surface of a first circuit board with a second circuit member wherein a plurality of second circuit electrodes are formed on a major surface of a second circuit board so that the first circuit electrodes are electrically connected with the second circuit electrodes in such a manner that the first and second circuit electrodes face each other. The circuit connecting material contains an adhesive composition, a conductive particle, and a plurality of insulating particles containing one or both of a polyamic acid particle and a polyimide particle.
申请公布号 WO2008023565(A1) 申请公布日期 2008.02.28
申请号 WO2007JP65376 申请日期 2007.08.06
申请人 HITACHI CHEMICAL COMPANY, LTD.;TATSUZAWA, TAKASHI;KOBAYASHI, KOUJI;FUKUSHIMA, NAOKI;KOBAYASHI, TAKANOBU;ITO, AKIHIRO 发明人 TATSUZAWA, TAKASHI;KOBAYASHI, KOUJI;FUKUSHIMA, NAOKI;KOBAYASHI, TAKANOBU;ITO, AKIHIRO
分类号 H01R11/01;C09J9/02;C09J11/08;C09J201/00;H01B1/22;H01R12/16;H05K1/14;H05K3/36 主分类号 H01R11/01
代理机构 代理人
主权项
地址