发明名称 METHOD FOR FORMING WIRING PATTERN
摘要 PURPOSE:To form a good-quality wiring pattern excellent in conductivity even on a base material of polymer by using a metallic filmlayer as the deposition starting base material of a metal for a wiring pattern in laser CVD. CONSTITUTION:A metallic film is formed on the surface of a polymer base material for wiring, the base material is introduced into a raw gas atmosphere, the metallic film layer is irradiated with a laser beam in accordance with a wiring pattern, hence a metallic layer for wiring pattern consisting of the decomposition product of the raw gas and consisting of a metal different from the metallic film is selectively deposited on the metallic film, and the part of the metallic film layer unirradiated with the laser beam is selectively removed. Accordingly, a high-quality minute wiring pattern is formed on various polymer base materials, e.g. on the surface of the tip of a catheter.
申请公布号 JPH06346244(A) 申请公布日期 1994.12.20
申请号 JP19930133648 申请日期 1993.06.03
申请人 MITSUBISHI CABLE IND LTD;ESASHI MASAKI 发明人 MAEDA SHIGEO;YAMAMOTO KEISUKE;TOYAMA OSAMU;ESASHI MASAKI
分类号 B23K26/00;C23C16/48;H01L21/3205;H01L23/12;H01L23/52;H05K3/06;H05K3/14;(IPC1-7):C23C16/48;H01L21/320 主分类号 B23K26/00
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