发明名称 IMPEDANCE BOND
摘要 <p>PURPOSE:To obtain an impedance bond which can reduce dimension and weight and can realize oilless formation. CONSTITUTION:An E-E type piled iron core 1 and coils 5-7 are accommodated in a case 3 made of iron, and a heat conductive insulating sheet is installed between the E-E type piled iron core 1 and the case 3 made of iron, and the inside of the case 3 made of iron is charged with epoxy resin, and the generated heat is liberated through the heat conductive insulating sheet.</p>
申请公布号 JPH06344909(A) 申请公布日期 1994.12.20
申请号 JP19930134200 申请日期 1993.06.04
申请人 MEIDEN CHEM KK;MEIDENSHA CORP 发明人 YONAHARA KUNIO;YAMAMOTO MASAAKI;TAKAHASHI HISAO;INATOMI YUTAKA
分类号 B61L1/18;H01F30/00;(IPC1-7):B61L1/18;H01F31/00 主分类号 B61L1/18
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