发明名称 RESIN COMPOSITION AND PRINTED CIRCUIT BOARD MADE USING THE SAME
摘要 PURPOSE:To obtain a resin composition which is useful for effectively producing a printed circuit board excellent in appearance and color tone. CONSTITUTION:This resin composition comprises a matrix consisting of an uncured resin sparingly soluble in acids or oxidizing agents and, dispersed in the matrix, cured heat-resistant resin particles soluble in acids or oxidizing agents, the matrix and/or the resin particles containing a dye. This composition is used to fabricate a printed circuit board.
申请公布号 JPH06345981(A) 申请公布日期 1994.12.20
申请号 JP19930247799 申请日期 1993.10.04
申请人 IBIDEN CO LTD 发明人 ASAI MOTOO;KATO RITSUKO
分类号 C08L101/00;H05K1/03;H05K3/46;(IPC1-7):C08L101/00 主分类号 C08L101/00
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