| 摘要 |
A cordless wand device for grasping objects such as silicon wafers during the manufacture of integrated circuits. The wand device comprises a housing having a hollow interior and a tip for grasping objects. The tip is attached to the housing through a hollow tube, and has a perimeter region contoured to form an airtight seal when placed against the surface of an object to be grasped. The tip also has a recessed interior region having an air inlet therein. The wand device includes a power source and a vacuum pump positioned within the housing. The vacuum pump produces a suction force at the air inlet on the tip. When the tip is placed against the surface of an object, the object is securely grasped due to the suction force exerted thereon by the wand tip. A switch located on the wand may be used to turn the vacuum pump on or off in order to grasp or release the object. Light-emitting diodes of different colors indicate to an operator whether or not the power source is sufficiently charged to generate sufficient suction force to safely grasp the object.
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