发明名称 |
Method and apparatus for electrodeposition of a metallurgically bondable circuitized flexible substrate |
摘要 |
Disclosed is a multi-compartment electroplating tank and a process for using the tank to simultaneously plate dissimilar materials onto a substrate.
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申请公布号 |
US5374344(A) |
申请公布日期 |
1994.12.20 |
申请号 |
US19930097810 |
申请日期 |
1993.07.27 |
申请人 |
INTERNATIONAL BUSINESS MACHINES, INC. |
发明人 |
GALL, THOMAS P.;WILCOX, JAMES |
分类号 |
H05K3/24;(IPC1-7):C25D5/02;C25D5/12 |
主分类号 |
H05K3/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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