| 摘要 |
PURPOSE:To provide the subject prepreg, low in the rate of dimensional change and excellent in resistance to metal migration, while retaining the other characteristics as the printed circuit boards. CONSTITUTION:The objective prepreg can be obtained by impregnating a base material with a varnish essentially comprising (A) an epoxy resin, (B) a polycondensate of bisphenol A and formaldehyde, (C) an inorganic filler and (D) a reducing agent followed by drying. |
