| 发明名称 |
Upward soldering method |
| 摘要 |
A printed wiring board having an electronic component mounted thereon is disposed with a land of pattern directed downward, and the land and a lead terminal of the electronic component are irradiated with a light beam emitted upwardly and supplied with a solder forwarded upwardly.
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| 申请公布号 |
US5373985(A) |
申请公布日期 |
1994.12.20 |
| 申请号 |
US19930149336 |
申请日期 |
1993.11.09 |
| 申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
CHIBA, HIROMU;KOBAYASHI, MAKOTO |
| 分类号 |
B23K1/005;B23K101/42;H05K3/34;(IPC1-7):H05K3/34 |
主分类号 |
B23K1/005 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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