| 摘要 |
A semiconductor measuring apparatus having a measuring test head having a connection portion to which a circuit to be measured may be connected, a monitoring test head for connection to the connection portion of the measuring test head during a debugging operation, a measuring power source connected to the measuring test head, a monitor power source connected to the monitoring test head, an electrical signal measuring device connected to both the measuring test head and the monitoring test head, and a control unit for controlling the measuring power source, the monitor power source, and the electrical signal measuring device, causing the electrical signal measuring device to measure an output signal from the measuring test head during measurement of a circuit and causing the electrical signal measuring device to measure an output signal from the monitoring test head during a debugging operation. |
