发明名称 Laser cutting process
摘要 PCT No. PCT/JP89/01050 Sec. 371 Date Apr. 2, 1992 Sec. 102(e) Date Apr. 2, 1992 PCT Filed Oct. 12, 1989 PCT Pub. No. WO91/05631 PCT Pub. Date May 2, 1991.The present invention relates to a laser cutting process which can easily obtain a fine cut surface without attaching any dross thereto. The laser cutting process comprises the steps of: applying a piercing to a workpiece by irradiating a laser beam toward a focus thereof adjusted onto an upper surface of the workpiece under as a condition as using air having a relatively low pressure; ejecting air having a high pressure toward a cutting portion of the workpiece from a nozzle main body for emitting the laser beam mounted on a laser processing machine under the condition such that the laser beam is irradiated from the nozzle main body toward a focus thereof adjusted onto a rear surface of the workpiece or the proximity thereof; and cutting the workpiece while blowing off dross generated upon the cutting operation by means of the ejected high pressure air.
申请公布号 US5374803(A) 申请公布日期 1994.12.20
申请号 US19920856166 申请日期 1992.04.02
申请人 KABUSHIKI KAISHA KOMATSU SEISAKUSHO 发明人 YAMADA, MASAHIRO
分类号 B23K26/14;B23K26/36;(IPC1-7):B23K26/00 主分类号 B23K26/14
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