| 摘要 |
PURPOSE:To detect the abnormality of a lead in high accuracy by providing the means for a detecting part, pressure conversion, driving control and discrimination, and making it possible to inspect the lead of a chip component under the state of closeness to the mounting. CONSTITUTION:When a nozzle member 20 is driven and an IC 40 is pushed to a detecting part 24a with specified force, a display part 24b displays the image of the contact part of the IC 40 to the detecting part 24a. Namely, a connecting part 42 of a lead 41, which forms the mounting surface on a printed board, becomes the contact part to the detecting part 24a. The display part 24b displays the image, which indicates the contact part 42 of each leas 41. The image is picked up with a camera 25 and the image signal is outputted into an operating device 33 The state of the lead is detected on the basis of the information outputted in response to the pressure fluctuation in the detecting part 24a. The acceptability is judged with a main operating part 32 through the operating device 33 and the quality of a chip component is judged. This method makes it possible to inspect the lead of the chip component under the state of more closeness to the mounting. The abnormality of the lead, which can be discriminated only when the lead is actually mounted, can be detected. |
