Verfahren zur Montage von einer Halbleiteranordnung.

摘要

A method for mounting a semiconductor device (13) wherein a semiconductor device (13) on which connection electrodes (14) are formed is connected to a circuit board (16) on which electrodes (17) are formed in positions corresponding to the connection electrodes (14) of the semiconductor device (13), the method including steps of applying an adhesive (20) on a connection face of the semiconductor device (13) to the circuit board (16) or that of the circuit board (16) to the semiconductor device (13) aligning the electrodes (14,17) in positions corresponding to each other with the semiconductor device (13) opposed to the circuit board (16), partially curing the adhesive (20b) in portions other than the electrodes (14,17) electrically evaluating the connection of the semiconductor device (13) to the circuit board (16) and curing the uncured adhesive (20).