Ultraviolette Laserablation und Ätzen von organischen Feststoffen.

摘要

A method and apparatus are described which enhance the ablative effect of a UV laser (10). The ablative effect of a pulsed UV laser (10) is enhanced using a second, longer wavelength pulsed laser (20). Each pulse of the first laser (10) is followed by or combined with a pulse from the second laser (20). The etch depth per pulse is controlled by varying the time between pulses from the first (10) and second (20) lasers. The maximum etch depth per pulse occurs at a time separation which is a function of the substrate (50) being etched. The first laser (10) wavelength is selected to be within the absorption spectrum of the unexcited surface molecules of the substrate (50), while the wavelength of the second laser (20) is selected to be within the absorption spectrum of the surface molecules excited by the incident radiation of the first laser (10).