WAFER LEVEL PACKAGE PREVENTING A CHIPPING DEFECT AND MANUFACTURING METHOD THEREOF

摘要

A wafer level package having a molding part of suppressing breakage is provided to form encapsulation resin on a wafer level package by a simplified process by forming encapsulation resin on six surfaces of a semiconductor chip by only one molding process. A connection part(110) of a protrusion type is formed on the surface of a semiconductor chip. A molding part(112) for suppressing breakage surrounds six surfaces of the semiconductor chip, exposing the connection part. A silicon exposure part is partially formed on the lateral surface of the molding part. The connection part can be one of a solder ball or a solder bump. The silicon exposure part can exist in the center region of the lateral surface of the semiconductor chip.