| 摘要 |
A connecting material for anisotropically electroconductive connection for bonding and connecting a semiconductor element having a plurality of electrodes disposed recedingly from the outer face of the passivation layer formed on the semiconductor element, on the one hand, with a substrate circuit board having a plurality of electrodes in a correspondingly confronted relation to the electrodes of the semiconductor element, on the other hand, which connecting material can afford to attain simultaneously a reliable mechnical bonding of the element with the circuit board and a secured electroconductive connection between the correspondingly confronted electrodes without suffering from damage of the passivation layer even if the passivation layer is made of a resin. The said connecting material (6) comprises an adhesive component (7) of insulating property and electroconductive particles (8), wherein each of the electroconductive particles (8) comprises a resin core particle (8a) coated with a metal layer (8b) and the average particle size d of the electroconductive particles (8) is at least 1.5 times the receding depth h of the electrodes (4) from the outer face of the passivation layer (5) of the semiconductor element (3) and at most 0.5 time the distance s between the neighboring electrodes (4). <IMAGE> |
