| 摘要 |
PURPOSE:To eliminate disconnection at a component mounting process and to prevent a detect of a package on which a component has been mounted by a method wherein a thermal stress is exerted, by using a heating block, on both the surface and the rear of a printed wiring board on which a conductive pattern has been formed. CONSTITUTION:A through hole 3 is made in a laminated board 1 which is provided with a fine circuit 10 on an inner-layer board and on which copper foils 2 have been laminated on both the surface and the rear via insulating layers. The whole surface of the laminated board 1 is plated; conductive layers 4 are formed. Then, exposed parts of the conductive layers 4 and the copper foils 2 on the laminated board 1 are etched and removed; conductive patterns are formed. Heating blocks which have been heated and whose temperature has been controlled are pressed simultaneously on both the surface and the rear of the laminated board 1 where the patterns have been formed; a thermal stress is exerted on the laminated board 1. A solder resist layer 6 is formed in a prescribed part of the laminated board 1 where the conductive patterns have been formed. Thereby, a disconnection by the thermal stress is not caused; a defect of a whole package board where components have been mounted is not caused. |
